Heterogeneously integrated silicon photonics and Self-Assembled-Monolayer wafer bonding (Or - what alchemy and silicon photonics have in common?!)

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Next BIU Engineering Colloquium: Idan Bakish, Monday 30/9 at 16:00, building 1103, Room 329 

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Heterogeneously integrated silicon photonics and Self-Assembled-Monolayer wafer bonding (Or - what alchemy and silicon photonics have in common?!)

 

 

Idan Bakish, the group of Dr. Avi Zadok, Faculty of Engineering, Bar-Ilan University

 

Abstract: Silicon photonics is expected to be a key player in the field of Interconnects and optical sensors. Silicon is well-known for its ability to transport light in the near-IR wavelengths with minimal attenuation. Modern devices are heterogeneously integrating silicon with other materials to form hybrid structures that are able also to actively control the light on an almost traditional CMOS platform.

In this talk I will introduce the field of silicon photonics and describe the main building blocks that are used in order to build Hybrid Photonic Integrated Circuits. I will also present a new bonding method that uses self-assembled-monolayers to bond crystalline materials with different lattice constants and expansion coefficients and can be used to fabricate new active photonic device on a chip.

Silicon photonics is an emerging technology in the world and also in Bar-Ilan University. The examples in the talk will be taken from our fabrication work in BIU. The bonding method was developed in a collaborative work of our group with the group of Prof. Chaim Sukenik from the chemistry department.

No prior knowledge is needed and students from all disciplines are welcome to join and enjoy.

תאריך: 
30/09/2013 - 16:00
מרצה: 
Idan Bakish
דוא"ל להרשמה: 
Affiliation: 
Faculty of Engineering, Bar-Ilan University
מיקום: 
building 1103, Room 329